Number of zones | 6 heating zones / 1 cooling zone |
---|---|
Heating method | Upper hot air + far infrared heating / lower far infrared heating method |
Maximum set temperature | Upper 350 ℃ / Lower 350 ℃ |
Effective board width | 50~160mm |
Transport method (selection type) | Pin chain transfer / mesh transfer |
Transport speed | 0.1~0.5m/min |
Effective height of parts | Top surface 5mm / Bottom surface 5mm |
Oxygen meter | Equipped as standard |
supported language | Japanese / English / Chinese / Korean |
PC outlet | 1 piece (100V) |
Board mounting allowance | 4mm |
Path line | 900±20mm |
Input power supply | AC200V 3φ 19kVA 55A |
Device dimensions※( ) is for mesh | L2,180(2,270)×D960×H1,380mm |
Device weight | 600kg |
Substrate effective width expansion (maximum 220 mm) |
Flux recovery device |
Automatic width adjustment mechanism |
Through type anti-slip mechanism (elevating type) |
Overheat prevention device |
Board drop sensor |
Oxygen concentration controller |
N2 all zone supply |
N2 all zone sampling |
Low oxygen concentration specification (100ppm or less) |
Cooling enhancement unit / cooling chiller |
UPS (non-disruptive power supply) |
Power transformer |
Doorway conveyor extension |
Circulation fan stop detection |
Hood interlock |
Emergency stop button position change |
Reflow checker (profile measurement unit) |
Various cooling conveyors and transfer conveyors |
Change paint color |