Wearable product implementation issues 2

Flux characteristics
If the flux has high heat resistance, the residue may inhibit fillet formation, so a fast thermal reaction and long-lasting flux are required.

Solder type 6 printed on a copper plate is heated with a hot plate to melt it.
Since it is heated only by the lower heater, there is almost no deterioration of the flux.
Both company A and company B are melted cleanly.

The larger the amount of solder printed, the better the wettability of the solder is due to the increased amount of flux.

The difference in flux between company A and company B appears as the difference in wettability.
It is necessary to create a temperature profile suitable for each flux.
The difference in gloss is the difference in cooling rate and represents the thermal reaction characteristics of the flux.

Temperature profile
The temperature profile has no meaning in its shape.
Basically, the time, set temperature of the heater used, and conveyor speed differ depending on the performance / characteristics of the reflow furnace, board design / material / mounted parts, and solder used by melting the solder without deteriorating the flux. The number one cause of flux deterioration is

・ Preheat time
・ Fan of the upper heater during preheating (hot air)
・ Preheat heat

Most problems including wettability can be solved by paying attention to the above three points and suppressing the deterioration of the flux during preheating.
Side balls, parts floating, misalignment, etc. are caused by a sudden rise in temperature when passing through the melting point, so a gentle temperature gradient can be used.

Regarding opinions and questions regarding this article and content

The technical information posted here was written by Mr. Kazuo Kawai, an implementation advisor, at the request of our company.
If you have any questions regarding the articles listed, please contact Kawai Advisor via our company if you contact us from our website.
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